ADVANCED ANALYTICAL TECHNOLOGY FOR ELECTRONICS RESEARCH & QUALITY CONTROL

PROVEN MATERIAL ANALYSIS, IDENTIFICATION, & QUANTITATION TO HELP YOU PROVIDE SAFE, EFFICIENT, & TRUSTWORTHY PRODUCTS

WAFER FABRICATION

To ensure optimum device performance, it is important to evaluate the grains and crystal defects within the mono crystal substrate prior to film growth.

FILM GROWTH, ELECTRODE DEPOSITION

Crystalline perfection and thickness of thin-film layers directly impact device performance. Our high-resolution and high-speed X-ray diffraction systems is able to independently determine each of these critical parameters with high-precision.

DICING, PACKAGING

Measurement of individual components within a chip requires an instrument that is able to analyze minute regions of a semiconductor device. By using an X-ray diffraction system with micro-focus optics combined with a high-speed 2D detector, rapid high-intensity micro-area measurements can be performed.

PCB

X-ray imaging is an indispensable tool for the characterization of failure mechanism within a single chip on a PCB. Using 3D volume reconstruction and 2D slice rendering, the inner structure and defects can be clearly visualized non-destructively.

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